MEMS DEVICES
Mems devices fabricated under community chip fabrication program(NPMASS)
MEMS Devices fabricated under Community Chip Fabrication Program(NPMASS)
NMDC– REC is very active in submitting successful design files for fabrication to Community Chip Fabrication Program, sponsored by NPMASS Program. We have fabricated Silicon Micro Tweezers, Micro Heater, MEMS Gyroscope, Digital Microfluidic device and MEMS Tri-axes Accelerometer under this program.
MEMS Gyroscope
The design and simulation of MEMS Gyroscope using POLY-MUMPS process flow was done at NMDC-REC. The devices were fabricated by POLY-MUMPS foundry at MEMSCAP Inc. through NPMASS.
Characterization of the devices were carried out at CeNSE, IISc, Bangalore. Figures on left and right sides show the SEM picture and the modes of vibration on the fabricated device.
Journal paper submitted to J.Micro/Nanolith. MEMS MOEMS
Micro Tweezer
The design and simulation of Electro-thermally actuated silicon microtweezers using SOI-MUMPS process flow was done at NMDC-REC. The devices were fabricated by SOI-MUMPS foundry at MEMSCAP Inc. through NPMASS.
Characterization of the devices were carried out at CeNSE, IISc, Bangalore. The displacement of each arm is observed to be 24 μm for the applied voltage of 10 V. The response time of the device is less than 5 ms and the maximum power dissipation is 110 mW.
J.Micro/Nanolith. MEMS MOEMS. Vol. 12, Issue 3, 033020 Sep 2013.
Tri-axes Accelerometer
The design and simulation of Tri-axes Accelerometer using SOI-MUMPS process flow was done at NMDC-REC. The devices were fabricated by SOI-MUMPS foundry at MEMSCAP Inc. through NPMASS.
Characterization of the devices have to be carried out at CeNSE, IISc, Bangalore. Figures on left and right sides show the SEM picture and the simulated results respectively.
Presented at ICMEMSS 2014.
Digital Microfluidics
The design for digital microfluidic device by electro wetting on dielectric (EWOD) was done at NMDC-REC. The devices were fabricated at C-MET, Pune using Low Temperature Co-fired Ceramic (LTCC) Technology.
Wires were soldered to contact points on the bottom electrode array and terminated in a 10-pin IDE socket. A conducting wire clipped to the hardened silver paste on the ITO sheet provides electrical connection to the ITO top electrode.
Presented at ICMEMSS 2014.
Digital Microfluidics
The design for digital microfluidic device by electro wetting on dielectric (EWOD) was done at NMDC-REC. The devices were fabricated at C-MET, Pune using Low Temperature Co-fired Ceramic (LTCC) Technology.
Wires were soldered to contact points on the bottom electrode array and terminated in a 10-pin IDE socket. A conducting wire clipped to the hardened silver paste on the ITO sheet provides electrical connection to the ITO top electrode.
Presented at ICMEMSS 2014.
If the facts don't fit the theory, change the facts.
-Albert Einstein